SUSS MicroTec Launches XBC300 Gen2 D2W Hybrid Bonding Platform

SUSS MicroTec, a major player in semiconductor equipment, has unveiled the XBC300 Gen2 D2W platform, a comprehensive solution for die-to-wafer hybrid bonding. This new platform highlights SUSS's leadership in providing fully integrated bonding solutions tailored for high-precision requirements.

The XBC300 Gen2 D2W platform is designed for 200mm and 300mm substrates, featuring space savings of up to 40% and a precision of less than ±200 nm. The platform merges surface activation and die positioning in a singular automated process, enhancing cleanliness and control.

This platform is particularly suited for 3D IC technologies, improving efficiency in high-bandwidth memory applications. Developed in collaboration with SET Corporation, the platform integrates ultra-precise bonding technology, now available for demonstrations in Germany.