Comet Joining Forces with JOINT3 Consortium

Comet Holding AG, through its IXS division, has joined the JOINT3 Consortium. The collaboration aims to advance next-generation semiconductor packaging. This aligns with Comet's strategy to expand the use of its x-ray technologies, enhancing its position in semiconductor packaging and inspection innovation.

JOINT3, led by Resonac Corporation, focuses on developing materials, equipment, and design tools for panel-level organic interposers. This consortium unites industry leaders in the semiconductor supply chain. A prototype line is in place for 515 x 510mm panel-level interposers to innovate manufacturing processes from circular wafers to square panels.