Elmos Semiconductor SE and SK keyfoundry Strengthen Collaboration with 130nm Technology Agreement

On September 9, 2026, Elmos Semiconductor SE and SK keyfoundry solidified their partnership in Frankfurt am Main by signing a pivotal agreement. The collaboration focuses on the expansion of their 130nm technology, ensuring wafer capacity availability until 2037. This move marks a significant enhancement of their 18-year partnership built on 350nm technology.

The 130nm technology from SK keyfoundry introduces deep-trench isolation, facilitating high-voltage designs with minimal substrate currents. This advancement supports Elmos' development of new products, including the eFuse controller E550.01, set for mass production in 2027. Furthermore, both companies plan to release a compact eFlash memory cell during the same year.

Dr. Arne Schneider of Elmos highlights the agreement as a foundation for future growth and reliability, while Derek D. Lee of SK keyfoundry emphasizes their shared pursuit of innovative semiconductor solutions. This strengthened alliance promises to fortify their positions in automotive electronics.