sur Hyundai Mobis
Hyundai Mobis and Qualcomm Join Forces for SDV and ADAS Development
Hyundai Mobis and Qualcomm have partnered to develop next-generation solutions for Software-Defined Vehicles (SDV) and Advanced Driver Assistance Systems (ADAS). The agreement, signed at CES 2026, targets integrated automotive solutions for emerging markets. Hyundai Mobis aims to enhance performance and stability for ADAS using Qualcomm's Snapdragon Ride Flex system-on-chip.
The partnership will extend beyond ADAS to deliver broader SDV solutions based on Snapdragon technologies. Initial developments include advanced driving and parking solutions, focusing on fast-growing markets such as India. These solutions will combine Hyundai Mobis's software platform with Qualcomm's automotive technologies.
At CES 2026, Hyundai Mobis displayed its strategy to broaden its order portfolio, focusing on robotics and semiconductors. The company engaged with over 200 representatives from major North American and European customers, underscoring its commitment to high-quality client interactions.
R. E.
Copyright © 2026 FinanzWire, tous droits de reproduction et de représentation réservés.
Clause de non responsabilité : bien que puisées aux meilleures sources, les informations et analyses diffusées par FinanzWire sont fournies à titre indicatif et ne constituent en aucune manière une incitation à prendre position sur les marchés financiers.
Cliquez ici pour consulter le communiqué de presse ayant servi de base à la rédaction de cette brève
Voir toutes les actualités de Hyundai Mobis