Imec Addresses Thermal Challenges in 3D HBM-on-GPU Architectures

Imec, a research and innovation hub, has made significant strides in mitigating thermal bottlenecks in 3D High Bandwidth Memory (HBM) on Graphics Processing Unit (GPU) architectures. Utilizing a system-technology co-optimization (STCO) approach, Imec has reduced peak temperatures from 140.7°C to 70.8°C during AI workloads. This development enhances performance density for next-generation GPU-based systems, crucial for AI applications.

This marks a debut for Imec's cross-technology co-optimization (XTCO) program, showcasing a more thermally robust computing system. "This is a milestone in developing advanced compute systems," stated Julien Ryckaert from Imec.

The accomplishment represents Imec's commitment to innovation in semiconductor technologies, addressing the increasing demands of AI workload management and thermal efficiency.